Toshiba Memory Europe GmbH (TME) today announced the launch of their second-generation line-up of NAND flash memory products for embeded applications featuring increased performance and capacity[1]. With support for high-speed data transfers, the new Serial Interface NAND products are compatible with the widely used Serial Peripheral Interface (SPI) and are suited for a wide range of consumer, industrial and communication applications. Sample shipments start today with mass production scheduled to begin from October onwards.
With the devices getting smaller in IoT and communication applications, demand for large capacity flash memory in small packages that can handle high-speed data transfers with low pin count is increasing. Due to its compatibility with the widely used SPI, the Serial Interface NAND products can be utilized as SLC NAND flash memory products with a low pin count, small package and large capacity.
In order to support high-speed data transfers, the new second-generation Serial Interface NAND products offer improved performance compared to existing first-generation products[1], including 133 megahertz (MHz) operating frequency and program x4 mode. Furthermore, an 8 gigabit[2] (1 gigabyte[2]) device has been added to the line-up to respond to demands for larger memory capacity. The entire line-up is offered in an 8-pin WSON[3] package of 6 x 8 mm dimension.
Key Features
- 1 – 8 gigabit (Gb) capacities
