TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, has unveiled its new high-power pin and socket product portfolio, addressing high current rating demands from high-speed board-to-board and board-to-busbar data communication applications. The new portfolio currently includes ICCON Block and ICCON Insert connectors. These new products can offer flexible design options and a floating feature for easy installation for applications up to 350A.
Easy installation is enabled by an optional floating feature on the ICCON Insert products that allows for +/- 1mm radial misalignment when mating two printed circuit boards (PCBs) or busbars. Flexible design options in various mounting types can fit different assembly process requirements. Standard pin sizes can support 30A
to 350A of power. Customizable stack height options can be offered by different lengths of power pins. By using TE’s proven CROWN BAND Plus socket design in many sizes, this portfolio can provide low contact resistance and low power consumption.
“Products with robust design and high-power capacity are commonly needed for high-speed data communication applications, such as servers, switches and storage. These applications’ board-to-board and board-to-busbar connection normally cannot be fully realized through other solutions like cable assemblies due to limited space and high-power density request,” said Lily Zhang, product manager at TE’s Data and Devices business unit. “TE’s innovative design and strong technical support empower our high-power pin and socket products’ reliable performance for high-speed data transmission among high-power applications.”
To learn more about TE’s ICCON Block and ICCON Insert products, click here.
