New crystal-clear UV adhesive for semiconductor production


At this year’s BondExpo Panacol will present Vitralit® UC 1535, a new transparent adhesive specifically designed for use in electronics. It hardens with UV light within a few seconds and can be used for semiconductor production due to its low ion content.

The Vitralit® UC 1535 is an epoxy-based UV-curing adhesive that hardens very fast. It is easy to dispense and non shear-thinning. In just a few seconds, the adhesive can be cured with radiation in the UVA range from 320 to 390 nm. For a fast and efficient curing, the broad spectrum and UV/LED systems from Dr. Hoenle AG are highly recommended.

The adhesive was especially designed for the assembly and production of electronic and optomechanical components. For example, the new Vitralit® UC 1535 is being used to bond glass lenses in optical systems. Once cured the adhesive features a transparent, optically clear and brilliant surface, which is very hard and scratch-resistant. Vitralit® UC 1535 is non-yellowing and remains optically clear even when exposed to high temperatures. Because of its low ion content the adhesive can be used for semiconductor applications.


Additional products to consider...