KIOXIA Debuts UFS Ver. 3.1 Embedded Flash Memory Devices


Further cementing its position as a leading provider of storage for next-gen mobile devices, KIOXIA Europe GmbH (formerly Toshiba Memory Europe) today announced that it has started sampling[1] Universal Flash Storage[2] (UFS) Ver. 3.1 embedded flash memory devices. Well suited for mobile applications including 5G networks requiring high-performance with low power consumption, the new line-up utilizes KIOXIA’s cutting-edge BiCS FLASH™ 3D flash memory and is supported in four capacities: 128GB, 256GB, 512GB, and 1TB[3].

 

The new devices integrate BiCS FLASH 3D flash memory and a controller in a JEDEC-standard 11.5mm x 13.0mm package. The controller performs error correction, wear leveling, logical-to-physical address translation, and bad-block management for simplified system development.

 

The newest offerings enable next-gen mobile devices to take full advantage of the connectivity benefits of 5G, leading to faster download and reduced lag time. As a result mobile customers benefit from the improved user experience of their mobile device.

 

“KIOXIA stays at the forefront of UFS memory development” comments Axel Störmann Vice President for Memory Marketing & Engineering, KIOXIA Europe GmbH “with UFS, first introduced by us in 2013[4] and UFS ver. 3.0 last year[5] the presentation of UFS 3.1. today, highlights KIOXIA’s dedication to advancement and innovation further.” he continues.


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