KIOXIA’s new Flash memory products offer enhanced storage and high reliability for industrial robotic deployments.
With the costs associated with robots continuing to fall and labour costs rising upwards, widespread adoption of robotics is now being witnessed across a broad spectrum of industry sectors – allowing a diverse range of applications to be addressed.
First aimed at simple and repetitive high-throughput production activities, now more advanced robotic systems are starting to be implemented. Referring to input data generated by numerous sensors, these systems are capable of carrying out a multitude of very complex tactile tasks.
To deal with all the data that increasingly automated environments will generate, it will be necessary to specify reliable and high-quality memory ICs from a trusted vendor. Such ICs must be able to deliver reliable performance over long periods, with minimal downtime and fully effective protection against potential sources of data loss. These devices must also offer a strong return on their initial investment, so that budget constraints can be dealt with. KIOXIA’s Universal Flash Storage (UFS) and e-MMC high-capacity Flash memories provide the necessary storage resource while reducing the workload placed upon the host processor. Product development can thereby be made more streamlined, which in turn shortens the time-to-market and eases deployment work. Both types of memory IC include a co-packaged controller, and provide error correction code (ECC), plus other key operational functions.
Key features of KIOXIA’s industrial grade e-MMCs include:
· JEDEC-compliant e-MMC interface version: 5.1
· Maximum data rate: 400MB/s
· Supply voltages: VCC 2.7V to 3.6V; VCCQ 1.70V to 1.95V, 2.7V to 3.6V
· Wide operating temperature range: -40°C to 105°C
· Package size:
o 11.5mm x 13.0mm x 1.0mm (8GB)
o 11.5mm x 13.0mm x 1.2mm (16GB-64GB)
· Ultra-low failure rates
Key Features of KIOXIA’s industrial grade UFS
• JEDEC-compliant UFS interface version: 2.1, 3.1
• Maximum data rate: 1160MB/s (2.1) resp. 2320MB/s (3.1)
• Higher density offering up to 512GB
• High-speed serial interface
• Ultra-reliable, robust technology (based on 15nm NAND and BiCS FLASHTM 3D
topologies)
• Integrated memory management:
· ECC mechanisms
· Bad block management
· Wear levelling
· Garbage collection
• Specific support functions (including built-in diagnostics, refresh, thermal throttling, pre-
programming, etc.)
• Power management functions to conserve electricity consumption
• Wide operating temperature range: -40°C to +105°C
Company: KIOXIA
