COM-HPC® Server Module With INTEL® Xeon® D-2700 Processor


Server-class performance with PCIe Gen4 and 100 Gbit network connectivity. 

The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24×7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.
The module accommodates 4x DIMM sockets for a maximum of 512 GB DDR4 memory at max 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting up to 100 Gbit Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures. The Kontron COMh-Server Eval Carrier offers a complete set of standard interfaces, such as USB and SATA, as well as 8x SFP28 Ethernet interfaces; thus supporting and optimizing the design-in phase of the COMh-sdID.

The most important features at a glance:

  • High-end server-grade platform
  • 8x LAN Ports: versatile configurations up to 100G
  • High-speed connectivity 32x PCIe 4.0 + 16x PCIe 3.0 SATA, USB 3.0
  • Up to 1TB NvMe SSD onboard
  • Industrial temperature versions
  • Embedded management controller.

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