HIROSE has introduced the DF58 series to deliver a space-saving, low profile, wire-to-board connectivity solution for miniature applications.
The connector range consists of crimp sockets and headers in a single row, the connectors feature a mated height profile which is minimised to 1.0mm and connector depth of only 4.97mm to reduce the space required on the board.
Although the connector is miniature in size the power rating has not been comprised. A high current rating capability of 3A (using the 2 contact version with 28AWG cable) can be achieved enabling the connectors to be used in power supply applications.
Secure connection is guaranteed with the ViSe (Vertical-insertion Swing-extraction) double-locking mechanism. The crimp socket is mated to the header in a vertical direction; however it is guided in at an angle to engage with the positive lock. This ensures high retention force in the upper direction and prevents the cables from easily being disconnected. The friction lock further prevents incomplete locking and floating after mating.
The DF58 connectors utilises highly reliable 2-point clipping contacts which stabilize contact resistance and reduce temperature rise. Furthermore, a long effective mating length of 0.29mm is achieved even though the low profile mated height is low at only 1.0mm.
Key Features
Contact positions: 2, 3, 4, 6
Contact pitch: 1.2mm
Current rating: 3.0A (2 contact version: 28AWG cable)
Voltage rating: AC/DC 100V
Mating cycles: 10
Cable size: AWG 28-30
The DF58 series is suitable for a wide range of applications such as wearable devices, service robots, drones, medical devices, point-of-sale equipment, digital cameras and many other small portable devices where reliability is a key requirement.
