The TRENCHSTOP™ Advanced Isolation represents Infineon´s answer to the limits reached by traditional packaging and isolation techniques. This new isolation package enables the highest power density, the best performance and the lowest cooling effort thanks to an effective and reliable thermal path from chip to the heatsink.
This package concept is able to match the highest requirements in terms of performance, design flexibility and ease of handling. By eliminating the need for thermal grease or thermal interface sheets the TRENCHSTOP™ Advanced Isolation is able to deliver at least 35% lower thermal resistivity and at least 10% system cost reduction, helping designers to lower system complexity, development time, and assembling costs.
TRENCHSTOP™ Advanced Isolation represent the cutting-edge technology in isolated packages and eliminates all the boundaries and constraints that until now have limited the designers’ ability to realize more powerful, more compact and highly differentiated systems.
