Samsung Electro-Mechanics Begins Mass Production of PLP (Panel Level Package)


Samsung Electro-Mechanics has started mass production of its next-generation semiconductor packaging PLP (Panel Level Package). PLP is fan-out packaging technology that does not use commonly used package substrates when mounting semiconductors onto a main board. Samsung Electro-Mechanics set PLP as its new core business and began operations in 2015; in 2016, the company invested KRW 263.2 billion to build the Cheonan PLP mass production line. Following the first shipment of samples in March 2018, mass production has now begun.

Samsung Electro-Mechanics’ PLP has been adopted for wearable devices, reducing size and thickness compared to existing technologies by packaging the AP (Application Processor) and PMIC (Power Management Semiconductor) in one package. With this technology, other components may be added in the remaining space to enhance the performance of the device or increase battery size. In addition, heat resistance can be improved and electric signals can be transmitted faster due to shorter lengths between semiconductor I/O terminals.

In the era of 5G mobile communications, AI and autonomous vehicles, Samsung Electro-Mechanics is positive that the infinite possibilities of Samsung Electro-Mechanics’ PLP will attract great interest and support.

http://www.samsungsem.com/global/support/regular/1479814_3584.jsp


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