Alliance Memory introduces new industrial-grade 3D pSLC embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications. Offering 30,000 program/erase cycles, the 5GB and 10GB devices integrate high-reliability 3D pSLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm by 1 mm 153-ball FBGA package.
Part Numbers:
Key Specifications and Benefits:
- High endurance with 30,000 program/erase cycles
- Feature high-reliability 3D pSLC NAND flash memory technology
- Compliant with the JEDEC eMMC v5.1 industry standard to support features such as:
- Boot operation
- Replay protected memory block (RPMB)
- Device health report
- Field firmware updates
- Power-off notification
- Enhanced strobe features for faster and more reliable operation
- Write leveling
- High-priority interrupt (HPI)
- Secure trim/erase
- High-speed HS200 and HS400 modes
- Backwards-compatible with eMMC v4.5 and v5.0
- Feature a 32MB boot partition
- Operate over an industrial temperature range of -40°C to +85°C
- Offer programmable bus widths of x1, x4, and x8
- NAND memory with internal LDO can be powered with a single 3V supply voltage
- The controller can be powered by 1.8V or 3V dual supply voltages
Target Applications:
- Smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, infotainment, surveillance, automation, point-of-sale systems, and emerging embedded applications
The Context:
Alliance Memory has extended its offering of eMMCs to include devices featuring 3D pSLC NAND flash memory technology, providing designers with more options to meet their solid-state storage needs in consumer, industrial, and networking applications. The 5GB and 10GB solutions integrate 3D pSLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm by 1 mm 153-ball FBGA package. Offering 30,000 program/erase cycles, the lower-density devices deliver higher reliability and endurance than MLC and TLC NAND solutions while maintaining the same ease of integration, speeding up product development and time to market while saving space by eliminating the need for an external controller.
Compliant with the JEDEC eMMC v5.1 industry standard, the eMMCs support features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. The devices are also backwards-compatible with eMMC v4.5 and v5.0.
Availability:
Samples of the eMMCs are available now. Production quantities are available with lead times of eight weeks.
Link to product datasheets and Buy Now information: ASFC5G31P3-51BIN and ASFC10G31P3-51BIN.
