Nano Dimension’s USA HQ, Sunrise, Florida, January 2021 – Nano Dimension Ltd. (Nasdaq: NNDM), a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, offers quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs™).
“Nano Dimension bridges the gap between PCB and semiconductor integrated circuits,” said Yoav Stern, CEO of Nano Dimension. “A revolution at the click of a button: From CAD to a functional high-performance AME device in hours, solely for the cost of the consumable materials. The DragonFly LDM® should be in everyone’s design workshop for rapid prototyping and testing. AME technology provides the capability to design and create free-form, multilayer complex circuit boards, bringing companies one-step closer to industry 4.0. With NaNoS℠, the AME fabrication service becomes the first point of contact and an effective and affordable exploration of AME technology’s capabilities. This is a wake-up call for entities that wish to explore adoption of 3D revolutionary design, manufacturing, and fabrication technology.”
The DragonFly LDM® system enables in-house 3D printing of highly complex, multilayered circuits containing embedded capacitors, antennas, coils, converters, and electro-mechanical components, in just hours.
Nano Dimension’s DragonFly LDM® systems are utilized in cutting edge research institutes, such as CBN-IIT (Italy) and the University of Technology in Sydney (Australia). These institutes continuously expand the design envelope by breaking free from traditional 2D PCB design rules, resulting in miniaturized, performance enhanced 3D AME devices.
With approximately 60 systems sold worldwide, Nano Dimension is also cooperating with customers and partners such as Hensoldt (Germany), L3Harris (USA), and others, to provide insights into how AME technology can drive forward electronics’ design.
Nano Dimension has initiated a webinar-series where scientists and engineers share findings and AME-based solutions in 3D-printed 5G antennas, advanced microwave devices, embedding, micro-electromechanical systems (MEMS) packaging and heterogeneous integration. This knowledge sharing series provides a platform for the free flow of information and an open dialogue between industry experts who are looking for innovative solutions.
