Discover KIOXIA’s BG4 Series. This Client NVMe™ SSDs (Solid-State-Drives) were tailor-made for thin, light and performance-oriented systems. The BG4 Series enables mobile computing and IoT embedded devices to be smaller and lighter with lower power consumption. Benefit also from fast transfer rates as well as high durability against shock and vibration.
Higher speed for more efficient output
BG4 series is an innovative, next generation, compact single package NVMe™ SSD. The product is based on KIOXIA’s BiCS FLASHTM 3D Flash Memory technology and includes a PCIe® Gen3x4 interface.
Thanks to its ultra-slim 2.2mm profile in M.2 2230 form factor, the product is suitable for thin, light and yet performance-oriented systems. BG4 is also available with 1.3mm profile in M.2 1620 (BGA) format to provide the advantages of SSD storage for ultra-compact devices. Both version have capacities from 128GB up to 1TB.
More technical features that convince
The compact devices incorporate four PCIe® Gen3 lanes, double that of the previous generation, delivering more performance in the same power envelope. With higher bandwidth and improved flash management and Host Memory Buffer (HMB) technology, BG4 delivers best-in-class read performance up to 2,300 MB/s sequential and write performance up to 1,800 MB/s sequential, respectively representing 53% and 80%* increases on the previous generation. Random read is 390,000 IOPS while write IOPS are 200,000, representing 1603% and 100%* improvements over the third-generation devices. Alongside the enhanced performance, BG4 SSDs feature a power-saving solution that improves power efficiency by 20% when reading and 7% while writing, along with a low-power mode that consumes just 5mW. For enhanced data security, BG4 is optionally available with self-encryption support.
*) Comparison of the product variants with the highest capacity of the respective product families BG3 (512GB) and BG4 (1TB).
What are the recommended applications for these SSDs?
BG4 Series is an ideal fit for demanding modern applications including:
- ultra-mobile and ultra-thin PCs
- 2-in-1 notebook PCs
- server and storage array boot drives
- IoT/embedded devices
- latest 5G/edge cloud computing applications.
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